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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays 1/ 35 ? 201 3 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 serial eeprom s eries standard eeprom i 2 c bus eeprom (2 - wire) br24t 16 - w general description br24 t 16- w is a serial eeprom of i 2 c bus interface method features ? completely conforming to the world standard i 2 c bus. all controls available by 2 ports of s erial clock ( scl) and serial data ( sda) ? other devices than eeprom can be connected to the same port, saving microcontroller port ? 1.6 v to 5.5v single power source operation most suitable for battery use ? 1. 6 v to 5.5v wide limit of operati ng vol tage, possible fast mode 400khz operation ? page write mode useful for initial value write at factory shipment ? self - timed programming cycle ? low current c onsumption ? prevention of write mistake ? write (write protect) function added ? prevention of write mistake at low voltage ? more than 1 million write cycles ? more than 40 years data retention ? noise filter built in scl / sda terminal ? initial delivery s tate ffh packages w(typ) x d(typ) x h(max) br24t 16- w capacity bit f ormat type power s ource voltage package 1 6 kbit 2k 8 b r24t 16 - w 1.6v to 5.5v dip - t8 b r24t 16 f - w sop8 b r24t 16 fj - w sop - j8 br24t16fj - wsgn sop - j8a b r24t 16 fv - w ssop - b8 b r24t 16 fvt - w tssop - b8 b r24t 16 fvj - w tssop - b8 j b r24t 16 fvm - w msop8 b r24t 16 nux - w vson008x2030 sop8 5.00mm x 6.20mm x 1.71mm sop - j8 4.90mm x 6.00mm x 1.65mm fig ure 1 . vson008x2030 2.00mm x 3.00mm x 0.60mm tssop - b8 3.00mm x 6.40mm x 1.20mm dip - t8 9.30mm x 6.50mm x 7 .10mm tssop - b8j 3.00mm x 4.90mm x 1.10mm msop8 2.90mm x 4.00mm x 0.90mm ssop - b8 3.00mm x 6.40mm x 1.35mm sop - j8 a 4.90mm x 6.00mm x 1. 7 5mm datashee t
data s heet 2 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 absolute m aximum r atings (ta = 2 5oc ) parameter symbol rating unit remark supply voltage v cc - 0 .3 to + 6.5 v power dissipation pd 450 (sop8) mw derate by 4.5mw/c when operating above ta=25c 450 (sop - j8) derate by 4.5mw/c when operating above ta=25c 450 (sop - j8a) derate by 4.5mw/c when operating above ta=25c 300 (ssop - b8) derate by 3.0mw/c when operating above ta=25c 330 (tssop - b8) derate by 3.3mw/c when operating above ta=25c 310 (tssop - b8j) derate by 3.1mw/c when operating above ta=25c 310 (msop8) derate by 3.1mw/c when operating above ta=25c 300 (vson008x2030) derate by 3.0mw/c when operating above ta =25c 800 (dip - t8) derate by 8.0mw/c when operating above ta=25c storage temperature tstg - 6 5 to + 15 0 c operating temperature topr - 4 0 to + 8 5 c input v oltage / output v oltage : - 0.3 to vcc + 1.0 v the max value of input voltage / output voltage is not over 6.5v . when the pulse width is 50ns or less, the min value of input voltage / output voltage is not lower than - 1.0v . ju nction t emperature t jmax 150 c junction temperature at the storage condition electrostatic discharge voltage (human body model) v esd - 4000 to +4000 v memory c ell c haracteristics ( ta=2 5oc , vcc=1.6v to 5.5v) parameter limit unit min typ max writ e c ycles (1) 1,000,000 - - times data r etention (1) 40 - - years ( 1 ) not 100% tested recommended o perating ratings parameter symbol rating unit power s ource v oltage vcc 1.6 to 5.5 v input v oltage v in 0 to vcc dc c haracteristics ( unless otherwise specified, ta = - 4 0 oc to +8 5oc , v cc = 1.6v to 5.5v ) parameter symbol limit unit conditions min typ max input high voltage1 v ih1 0.7vcc - vcc+1.0 v 1.7v vcc 5.5 v input low voltage1 v il1 - 0.3 (2) - + 0.3vcc v 1.7v vcc 5.5 v input high voltage 2 v ih 2 0. 8 vcc - vcc+1.0 v 1 .6v vcc >: 1.7 v input low voltage 2 v il 2 - 0.3 (2) - + 0.2vcc v 1.6v vcc >: 1.7 v out put low voltage1 v ol1 - - 0.4 v i ol = 3.0 ma , 2.5v vcc 5.5v (sda) out put low voltage 2 v ol2 - - 0.2 v i ol = 0.7 ma , 1.6v vcc >: 2 .5v (sda) input leakage current i li - 1 - 1 a v i n =0 to vcc output leakage current i lo - 1 - 1 a v out =0 to vcc (sda) supply current (write) i cc1 - - 2.0 ma vcc= 5 .5v, f scl = 400k hz, t wr = 5ms , byte write, page write supply current (read) i cc2 - - 0.5 ma vcc=5 .5 v, f scl = 400k hz random read, current read, seq uential read standby current i sb - - 2.0 a vcc=5.5v , sda scl=vcc a0,a1,a2=gnd,wp=gnd (2) wh en the pulse width is 50ns or less, it is - 1.0v.
data s heet 3 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 a c c haracteristics (unless otherwise specified, ta = - 4 0oc to +8 5 oc , v cc = 1.6v to 5.5v) parameter symbol limit unit min typ max clock frequency f scl - - 400 khz data clock high period t high 0.6 - - s data clock low period t low 1.2 - - s sda , scl (input) rise time (1) t r - - 1.0 s sda , scl (input) fall time ( 1 ) t f1 - - 1.0 s sda (output) fall time (1) t f2 - - 0.3 s start condition hold time t hd:sta 0.6 - - s start condition setup time t su:sta 0.6 - - s input data hold time t hd:dat 0 - - ns input data setup time t su:dat 100 - - ns output data delay time t pd 0.1 - 0.9 s output dat a hold time t dh 0.1 - - s stop condition setup time t su:sto 0.6 - - s bus free time t buf 1.2 - - s write cycle time t wr - - 5 ms noise spike width (sda and scl) t i - - 0.1 s wp hold time t hd:wp 1.0 - - s wp setup time t su:wp 0.1 - - s wp high period t high:wp 1.0 - - s (1) not 100% tested. condition input data level :v il =0.2vcc v ih =0.8vcc input data timing reference level : 0.3vcc/0.7vcc output data timing reference level : 0.3vcc/0.7vcc rise/fall time : 20ns s erial i nput / outpu t timing (input) (output) ? input read at the rise edge of scl ? data output in sync with the fall of scl fig ure 2 - (a ). s erial i nput / output t iming fig ure 2 - (b) . start - s top b it t iming fig ure 2 - (c) . wr ite c ycle t iming fig ure 2 - (d ). wp t iming at w rite e xecution fig ure 2 - (e) . w p ti ming at w rite c ancel start condition stop condition 30 % 30 % d 0 ack twr write data (n - th address) start condition stop condition 70 % 70 % data( 1 ) d 0 ack d 1 data(n) ack twr 30 % 70 % stop condition thd:wp tsu:wp 30 % data( 1 ) d 0 d 1 ack data(n) ack thigh:wp 70 % 70 % twr 70 % 70 % fig 1 - ( 4 ) write cycle timing fig 1 - ( 5 ) wp timing at write execution fig 1 - ( 6 ) wp timing at write cancel stop condition thd:wp tsu:wp data( 1 ) d 0 d 1 ack data(n) ack thigh:wp 70 % 70 % twr 70 % fig 1 - ( 5 ) wp timing at write execution fig 1 - ( 6 ) wp timing at write cancel scl sda ( sda (output) 70 % 70 % 70 % 70 % tsu:sta thd:sta start condition tsu:sto stop condition 30 % 30 % 70 % 30 % 30 % 70 %
data s heet 4 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 block diagram fig ure 3 . bloc k d iagram pin configuration (top view) pin description s terminal name input/ output d escriptions a0 - don h, 16 k bit eeprom array 1 1 bit 2 5 6 vcc scl gnd br 24t16 - w 1 3 4 7 8 wp sda a2 a1 a0 8 7 6 5 4 3 2 1 sda scl wp v cc gnd a2 a1 a0 16kbit eeprom array address decoder word address register data register control circuit high voltage generating circuit power source voltage detection 8 bit ack start stop
data s heet 5 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 fig ure 6 . o utput low voltage1 vs output low current (vcc= 2 . 5v ) fig ure 7 . output low voltage2 vs output low current (vcc= 1 . 6 v) fig ure 4 . input high voltage1 ,2 vs supply voltage (scl, sda, wp) fig u re 5 . input low voltage1 ,2 vs supply voltage (s cl, sda, wp) typical performance curves 1pin mark 0 1 2 3 4 5 6 0 1 2 3 4 5 6 supply voltage vcc(v) input low voltage: v il1 (v) ta=-40 0 0.2 0.4 0.6 0.8 1 0 1 2 3 4 5 6 output low current: i ol (ma) output low voltage2: v ol2 (v) ta=-40 ta= 25 ta= 85 spec 0 0.2 0.4 0.6 0.8 1 0 1 2 3 4 5 6 output low current: i ol (ma) output low voltage1: v ol1 (v) spec ta=-40 ta= 25 ta= 85 0 1 2 3 4 5 6 0 1 2 3 4 5 6 supply voltage: vcc(v) input high voltage: v ih1 (v) ta=-40 ta= 25 ta= 85 spec
data s heet 6 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 fig ure 11. supply current (read) vs supply voltage ( f scl =400khz) fig ure 8 . input leakage current vs supply voltage (scl, wp) fig ure 9 . output l eakage current vs supply voltage (sda) fig ure 10 . supply current (write) vs supply voltage (f scl =400khz) typical performance curves : continued 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 supply voltage: vcc(v) input leakage current: i li (a) ta=-40 ta= 25 ta= 85 spec 0 0.5 1 1.5 2 2.5 3 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (write): icc1(ma) ta=-40 ta= 25 ta= 85 spec 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 supply voltage: vcc(v) output leakage current : i lo (a) ta=-40 ta= 25 ta= 85 spec 0 0.1 0.2 0.3 0.4 0.5 0.6 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (read): icc2(ma) spec ta=-40 ta= 25 ta= 85
data s heet 7 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 fig ure 1 3. c lock frequency vs supply voltage fig ure 1 4. data c lock high period vs supply voltage fig ure 1 2. st andby current vs supply voltage fig ure 1 5. data clock low period vs supply voltage typical performance curves : continued 0 0.3 0.6 0.9 1.2 1.5 0 1 2 3 4 5 6 supply voltage: vcc(v) data clock low period : t low (s) spec ta=-40 ta= 25 ta= 85 0 0.5 1 1.5 2 2.5 0 1 2 3 4 5 6 supply voltage: vcc(v) standby current: i sb (a) spec ta=-40 ta= 25 ta= 85 0 0.2 0.4 0.6 0.8 1 0 1 2 3 4 5 6 supply voltage: vcc(v) data clock high period : t high (s) spec ta=-40 ta= 25 ta= 85 0 0.2 0.4 0.6 0.8 1 0 1 2 3 4 5 6 supply voltage: vcc(v) clock frequency: t hd:sta (s) spec ta=-40 ta= 25 ta= 85
data s heet 8 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 fig ure 1 7. s tart condition setup time vs supply voltage fig ure 1 8. inp ut data hold time vs supply voltage (high) fig ure 1 6. s tart condition hold time v s supply voltage fig ure 19. i np ut data hold time vs supply voltage (low) typical performance curves : continued -200 -150 -100 -50 0 50 0 1 2 3 4 5 6 supply voltage: vcc(v) input data hold time: t hd:dat (ns) spec ta=-40 ta= 25 ta= 85 -200 -150 -100 -50 0 50 0 1 2 3 4 5 6 supply voltage: vcc(v) input data hold time: t hd:dat (ns) spec ta=-40 ta= 25 ta= 85 -0.2 0 0.2 0.4 0.6 0.8 1 0 1 2 3 4 5 6 supply voltage: vcc(v) start condition setup time: t su:sta (s) spec ta=-40 ta= 25 ta= 85 0 0.2 0.4 0.6 0.8 1 0 1 2 3 4 5 6 supply voltage: vcc(v) start condition hold time: t hd:sta (s) spec ta=-40 ta= 25 ta= 85
data s heet 9 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 fig ure 2 3. h o l -200 -100 0 100 200 300 0 1 2 3 4 5 6 supply voltage: vcc(v) input data setup time: t su:dat (ns) spec ta=-40 ta= 25 ta= 85 -200 -100 0 100 200 300 0 1 2 3 4 5 6 supply voltage: vcc(v) input data setup time: t su:dat (ns) spec ta=-40 ta= 25 ta= 85 0 0.5 1 1.5 2 0 1 2 3 4 5 6 supply voltage: vcc(v) h output data delay time t spec spec ta=-40 ta= 25 ta= 85 0 0.5 1 1.5 2 0 1 2 3 4 5 6 supply voltage: vcc(v) l output data delay time: t spec spec ta=-40 ta= 25 ta= 85
data s heet 10 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 fig ure 2 4. stop condition setu p time vs supply voltage fig ure 2 7. noise spike width vs supply voltage (scl h) fig ure 2 5. bus free time vs supply voltage fig ure 2 6. write cycle time vs supply voltage typical performance curves : continued -0.5 0 0.5 1 1.5 2 0 1 2 3 4 5 6 supply voltage: vcc(v) stop condition setup time: t su:sto (s) spec ta=-40 ta= 25 ta= 85 0 0.5 1 1.5 2 0 1 2 3 4 5 6 supply voltage: vcc(v) bus free time : t buf (s) spec ta=-40 ta= 25 ta= 85 0 1 2 3 4 5 6 0 1 2 3 4 5 6 supply voltage: vcc(v) write cycle time: t wr (ms) ta=-40 ta= 25 ta= 85 spec 0 0.1 0.2 0.3 0.4 0.5 0.6 0 1 2 3 4 5 6 supply voltage: vcc(v) noise spike width(scl h):ti(s) spec ta=-40 ta= 25 ta= 85
data s heet 11 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 fig ure 29. n oise spike width vs supply voltage (sda h) fig ure 3 0. no ise spike width vs supply voltage (sda l) fig ure 3 1. w p hold time vs supply voltage fig ure 2 8. nois e spike width vs supply voltage (sc l l) typical performance curves : continued 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 supply voltage: vcc(v) wp hold time: t hd:wp (s) spec ta=-40 ta= 25 ta= 85 0 0.1 0.2 0.3 0.4 0.5 0.6 0 1 2 3 4 5 6 supply voltage: vcc(v) noise spike width(sda l): ti(s) spec ta=-40 ta= 25 ta= 85 0 0.1 0.2 0.3 0.4 0.5 0.6 0 1 2 3 4 5 6 supply voltage: vcc(v) noise spike width(sda h): ti(s) spec ta=-40 ta= 25 ta= 85 0 0.1 0.2 0.3 0.4 0.5 0.6 0 1 2 3 4 5 6 supply voltage: vcc(v) noise spike width(scl l): ti(s) spec ta=-40 ta= 25 ta= 85
data s heet 12 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 fig ure 3 2. wp setup time vs supply voltage fig ure 3 3 . wp high period vs supply voltage typical performance curves : continued -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0 1 2 3 4 5 6 supply voltage: vcc(v) wp setup time: t su:wp (s) spec ta=-40 ta= 25 ta= 85 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 supply voltage: vcc(v) wp high period: t high:wp ( spec ta=-40 ta= 25 ta= 85
data s heet 13 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 timing chart 1. i 2 c bus data c ommunication i 2 c bus data communication starts by start condition input, and ends by stop condition input. data is always 8bit long, and acknowledge is always required after each byte. i 2 c bus data communication with several devices is possible by connect ing with 2 communication lines : serial data (sda) and serial clock (scl). among the devices, there should be a , and the device that receives data DD w / r w / r write w / r 8 9 8 9 8 9 s p condition condition ack stop ack data data address start r/w ack 1-7 sda scl 1-7 1-7
data s heet 14 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 write command 1. write c ycle (1) arbitrary data can be written to this eeprom. when writ ing only 1 byte, b yte w rite is normally used, and when writ ing continuous data of 2 bytes or more, simultaneous write is possible by p age w rite cycle. the maximum number of bytes is specified per dev ice of each capacity. up to 8 arbitrary bytes can be written . (2) during internal write execution, all input commands are ignored, therefore ack is not returned . (3) data is written to the address designated by word address (n - th address) (4) by issuing stop bit after 8bit data input, internal write to memory cell starts. (5) when internal write is started, command is not accepted for t wr (5ms at maximum). (6) using page write cycle, writing in bulk is done as follows: when data of more than 16 bytes is sent, the bytes in exce ss overwrite the data already sent first . (refer to "internal a ddress i ncrement ") (7) as for page write cycle of br24t16 - w, where 2 or more bytes of data is intended to be written , after the page select bits p0, p1, and p2 w r i t e s t a r t r / w a c k s t o p word address(n) data(n) sda line a c k a c k data(n+15) a c k slave address 1 0 0 1 p 0 p 1 p 2 wa 7 d0 d7 d0 wa 0 wa7 wa4 wa3 wa2 wa1 wa0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 1 0 0 0 1 1 1 0 0 0 1 1 1 1 0 0 0 0 0 0 increment 0eh significant bit is fixed. no digit up p 1 p2 wa 7 d7 1 1 0 0 w r i t e s t a r t r / w s t o p word address data slave address p 0 wa 0 d0 a c k sda line a c k a c k
data s heet 15 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 read command 1. read c ycle read cycle is when d ata of eeprom is read. r ead cycle could be random read cycle or current read cycle. random read cycle is a command to read data by de signating a specific address, and is used generally. current read cycle is a command to read data of internal address register without designating an address, and is used when to verify just after write cycle. in both the read cycles, sequential read cycle is available where the next address data can be read in succession . (1) in random read cycle, data of designated word address can be read. (2) when the command just before current read cycle is random read cycle, current read cycle (each including sequential read cycle), data of incremented last read address (n) - th, i.e., data of the (n+1) - th address is output. (3) when ack signal ' low ' after d0 is detected, and stop condition is not sent from master ( - com) side, the next address data can be read in succession. (4) read cycle is ended by stop condition where ' h ' is input to ack signal after d0 and sda signal goes from l to h goes from l to h while from l to h while r e a d s t a r t r / w a c k s t o p data(n) sda line a c k a c k data(n+x) a c k slave address 1 0 0 0 1 0 p 0 p 1 p 2 d0 d7 d0 d7 s t a r t s t o p sda line a c k data(n) a c k slave address 1 0 0 0 1 p 0 p 1 p 2 d0 d7 r / w r e a d w r i t e s t a r t r / w a c k s t o p word address(n) sda line a c k a c k data(n) a c k slave address 1 0 0 0 1 p 0 p 1 p 2 wa 7 a0 d0 slave address 1 0 0 0 1 0 a1 a2 s t a r t d7 r / w r e a d wa 0
data s heet 16 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 software r eset software reset is executed to avoid malfunction after power on and during command input. software reset has several kinds and 3 kinds of them are shown in the figure below. ( refer to figure 40 - (a) , figure 40 - (b) , and figure 40 - (c) . ) within the dummy clock input area, the sda bus is released ( ' h ' by pull up) and ack output and read data ' 0 ' (both ' l ' level) may be output from eeprom . t herefore, if ' h ' is input fo rcibly, output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices . acknowledge p olling during internal write execution, all input commands are ignored, therefore ack is not returned . during internal automatic write execution aft er write cycle input, next command (slave address) is sent. if the first ack signal sends back ' l ' , then it means end of write operation , else ' h ' is returned , which means writing is still in progress . by the use of acknowledge polling, next command can be executed without waiting for t wr = 5ms. t o write continuously, = 0, t hen to carry out current read cycle after write, slave address with = 1 is sent . i f ack signal sends back ' l ' , and then execute word addres s input and data output and so forth. . 1 2 13 14 scl dummy clock14 s tart2 scl fig ure 4 0 - (a) . t he case of dummy clock 14 + start+start+ c ommand i nput d start command from start input. 2 1 8 9 dummy clock ? 9 start fig ure 4 0 - (b ). the case of start + d ummy c lock 9 + start + c ommand i nput start normal command normal command normal command normal command start ? 9 sda sda scl sd a 1 2 3 8 9 7 fig ure 4 0 - (c) . start9 + command input normal command normal command sda slave address word address p p s t a r t first write command a c k h a c k l slave address slave address slave address data w rite command duri ng internal write, ack = high is returned . after completion of internal write, ack=low is returned , so input next word address and data in succession. t wr t wr second write command s t a r t s t a r t s t a r t s t a r t s t o p s t o p a c k h a c k h a c k l a c k l fig ure 41. ca se of c ontinuous w rit e by a cknowledge p olling w / r
data s heet 17 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 wp v alid t iming ( w rite c ancel) wp is usually fixed to ' h ' or ' l ' , but when wp is used to cancel write cycle and so on , pay attention to the following wp valid timing. during write cycle execution, in side cancel valid area, b y setting wp= ' h ' , write cycle can be cancelled. in both byte write cycle and page write cycle, the area from the first start condition of command to the rise of clock to take in d0 of data(in page write cycle, the first byte data) is the cancel invalid are a. wp input in this area becomes
data s heet 18 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 i/o p eripheral c ircuit 1. pull - u p resistance of sda t erminal sda is nmos open drain, so it requires a pull up resist or . as for this resistance value (r pu ), select an appropriate value from mic rocontroller v il , i l , and v ol - i ol characteristics of this ic. if r pu is large, operating frequency is limited. the smaller the r pu , the larger is the supply current (read) . 2. m aximum v alue of r pu the maximum value of r pu is determined by the following factors. (1) sda rise time to be determined by the capacitance (c bus ) of bus line and r pu of sda should be t r or lower . furthermore, ac timing should be satisfied even when sda ri se time is slow . (2) the bus . electric potential ? a to be determined by the input current leak total (i l ) of device connected to bus at output of 'h' to the sda line and r pu should sufficiently secure the input 'h' level (v ih ) of microcontroller and eeprom including recommended noise margin of 0.2vcc . v cc - i l r pu - 0.2 v c c R [k] [] k k
data s heet 19 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 cautions o n m icrocontroller c onnection 1. r s in i 2 c bus, it is recommended that sda port is of open drain input/output. however, when us ing cmos input / output of tri state to sda port, insert a series resistance r s between the pull up resist or r pu and the sda te rminal of eeprom. this is to control over current that may occur when pmos of the microcontroller and nmos of eeprom are turned on simultaneously. r s also plays the role of protecti ng the sda terminal against surge. therefore, even when sda port is open dr ain input/output, r s can be used . 2. maximum v alue of r s the maximum value of r s is determined by the following relations. (1) sda rise time to be determined by the capacitance (c bus ) of bus line and r pu of sda should be t r or lower . furthermore, ac timing should be satisfied even when sda rise time is slow . (2) the bus ex) v cc =3v v il =0.3v cc v ol =0.4v r pu =20k 3. mi nimum v alue of r s the minimum value of r s is determined by over current at bus collision. when over current flows, noises in power source line and instantaneous power failure of power source may occur. when allowable over current is defined as i, the following relation mus t be satisfied. determine the allowable current in consideration of the impedance of power source line in set and so forth. set the over current to eeprom at 10ma or lower . ex) v cc =3v i=1 0 ma (vcc >+ v ol ) ? r s r pu +r s r pu microcontroller r s eeprom fi g ure 45. i/ o c ircuit d iagram fig ure 46. input / o utput c ollision t iming ack ' l ' output of eeprom ' h ' output of microcontroller over current flows to sda line by ' h ' output of microcontroller and ' l ' output of eeprom . scl sda fig ure 48. i/o c i rcuit d iagram fig ure 47. i/o circuit diagram +v o l +0.1vcc v il ? r s ? r pu v il >+ v ol >+ 0.1vcc 1.1vcc >+ v il 1.67 [k] [] r pu micro controller r s eeprom i ol a bus line capacity c bus v ol v cc v il microcontroller eeprom 'l' output r s r pu 'h' output over current i
data s heet 20 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 i/o equivalen ce circui t 1. input ( scl, wp) 2. input / o utput (sda) fig ure 49. in put pin circuit diagram fig ure 5 0. input / outpu t pin circuit diagram
data s heet 21 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 power - up / down conditions at power on , the ic s s boards t low t su:dat t dh after vcc be comes stable scl v cc sda t su:dat after vcc becomes stable t off t r v bot 0 v cc
data s heet 22 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 operational n otes 1. descri b ed numeric values and data are design representative values only , and the values are not guaranteed. 2. we believe that the applic ation circuit examples in this document are recommendable. however, in actual use, confirm characteristics further sufficiently. if changing the fixed number of external parts is desired, make your decision with sufficient margin in consideration of static characteristics, transient characteristics, and fluctuations of external parts and our lsi . 3. absolute m aximum r atings if the absolute maximum ratings such as supply voltage, operating temperature range, and so on are exceeded, lsi may be destroyed. do n ot supply voltage or subject the ic to temperatures exceeding the absolute maximum ratings. in the case of fear of exceeding the absolute maximum ratings, take physical safety countermeasures such as adding fuses, and see to it that conditions exceeding th e absolute maximum ratings should not be supplied to the lsi . 4. gnd e lectric p otential set the voltage of gnd terminal lowest at any operating condition. make sure that each terminal voltage is not lower than that of gnd terminal . 5. t hermal d esign use a th ermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. 6. short between p ins and m ounting e rrors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit may be caused by conductive parti cles caught between the pins . 7. operating the ic in the presence of strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently .
data s heet 23 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 part numbering b r 2 4 t 1 6 x x x - w x x x x x bus t ype 2 4 >8 i 2 c operating t emperature/ power s ource voltage - 40 to+ 85 / 1.6v to 5.5v capacity 16 = 16 k package b lank :dip - t8 f :so p8 fj :sop - j8 ( - we2) / sop - j8a ( - w sgn e2 ) fv : ssop - b8 fvt : tssop - b8 fvj : tssop - b8j fvm : msop8 nux : vson008x2030 doub le cell sgn : sop - j 8 a packaging and f orming s pecification e2 : e mbossed tape and reel ( sop8 , sop - j8, sop - j8a, ssop - b8,tssop - b8, tssop - b8j) tr : embossed tape and reel (msop8, v son008x2030) none : tube (dip - t8)
data s heet 24 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 physical dimensions tape and reel information
data s heet 25 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006
data s heet 26 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006
data s heet 27 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 package name sop - j8a
data s heet 28 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006
data s heet 29 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006
data s heet 30 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006
data s heet 31 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006
data s heet 32 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006
data s heet 33 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 marking diagrams (top view) dip - t8 (top view) br24t16 part number marking lot number sop8 ( top view) part number marking lot number sop - j8 ( top view) part number marking t 1 6 t 1 6 1pin mark lot number 1pin mark msop8 ( top view) part number marking lot number 1pin mark t 1 6 tssop - b8j ( top view) part number marking lot number 1pin mark t 1 6 tssop - b8 ( top view) part number marking lot number 1pin mark t 1 6 ssop - b8 ( top view) part number marking 1pin mark t 1 6 lot number sop - j8 a ( top view) part number marking t 1 6 lot number 1pin mark
data s heet 34 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 marking diagrams (top view) : continued vson008x2030 (top view) part number marking lot number 1pin mark t 1 6
data s heet 35 / 35 br24t 16 - w ? 201 3 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 0 01 www.rohm.com tsz02201 - 0r2r0g100110 - 1 - 2 30.aug.2017 rev.006 r e vision history date revision changes 1 8.may .2012 001 new release 2 5.feb .2013 002 update some english words, sentences
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number br24t16-w package dip-t8 unit quantity 2000 minimum package quantity 50 packing type tube constitution materials list inquiry rohs yes br24t16-w - web page distribution inventory

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